AET 450 - Electronic Components Packaging

When Offered: F, S

3 Credit(s)
3 Lecture Hour(s)
0 Lab Hour(s)

This course addresses basic issues in electronics packaging of single chip to multi-chip modules. Topics such as packaging process, clean room, bonding and sealing, and final packaging will be discussed. Student projects will include design, construction, and testing of packages for basic electronic components.

Prerequisite(s): AET 377.